Vacuum Equipment used in semiconductor production?

The semiconductor industry has surpassed the traditional steel industry and automobile industry, and has become a high value-added and high-tech industry in the 21st century. Semiconductors are the core of many industrial equipment and are widely used in core fields such as computers, consumer electronics, network communications, and automotive electronics.

Semiconductors mainly have four components: integrated circuits, optoelectronic devices, discrete devices and sensors; integrated circuits are the core of the semiconductor industry, accounting for more than 80%. Integrated circuits include logic chips, memory chips, analog chips, and MPUs. The rapid development of integrated circuits in performance, integration, speed, etc. is based on the development of semiconductor physics, semiconductor devices, and semiconductor manufacturing processes.

With such a huge market in the semiconductor industry, semiconductor process equipment provides a manufacturing basis for the large-scale manufacturing of semiconductors. In the future, the integration and miniaturization of semiconductor devices will be higher and more powerful. The main equipment in the semiconductor production process is attached below.

1 Single crystal furnace equipment function: melt semiconductor materials, pull single crystals, and provide single crystal semiconductor crystal blanks for subsequent semiconductor device manufacturing.

Single crystal furnace equipment function

2 Vapor phase epitaxy furnace

Equipment function: Provide a specific process environment for vapor phase epitaxy growth, realize the growth of thin-layer crystals corresponding to the single crystal phase on a single crystal, and make basic preparations for the realization of functionalization of the single crystal bottom. Vapor phase epitaxy is a special process of chemical vapor deposition. The crystal structure of the thin layer is the continuation of the single crystal substrate, and it maintains a corresponding relationship with the crystal orientation of the substrate.

Vapor phase epitaxy furnace

3 molecular beam epitaxy system

Equipment function: molecular beam epitaxy system, which provides process equipment for growing thin films on the surface of the sink; molecular beam epitaxy process is a technology for preparing single crystal thin films. The thin film is grown layer by layer in the direction of the crystal axis of the substrate material.

molecular beam epitaxy system

4 Oxidation furnace (VDF)

Equipment function: It is an indispensable part of the semiconductor processing process to carry out oxidation treatment for semiconductor materials, provide the required oxidation atmosphere, and realize the oxidation treatment process of the expected design of the semiconductor.

Oxidation furnace (VDF)

5 Low pressure chemical vapor deposition system (LPCVD)

Equipment function: The vapor containing the gaseous reactant or liquid reactant and other gases required for the reaction are introduced into the reaction chamber of the LPCVD equipment, and a chemical reaction occurs on the surface of the substrate to form a thin film.

Low pressure chemical vapor deposition system (LPCVD)

6 Plasma Enhanced Chemical Vapor Deposition (PECVD)

Equipment function: Glow discharge is used in the deposition chamber to ionize it and then conduct chemical reactions on the substrate to deposit semiconductor thin film materials.

Plasma Enhanced Chemical Vapor Deposition (PECVD)

7 Magnetron Sputtering Station (MSA)

Equipment function: Through a closed magnetic field parallel to the target surface in the diode sputtering, and the orthogonal electromagnetic field formed on the target surface, the secondary electrons are bound to a specific area on the target surface to achieve high ion density and high energy ionization. Target atoms or molecules are sputter-deposited at high rates on the substrate to form thin films.

Magnetron Sputtering Station (MSA)

8 Chemical Mechanical Polishers (CMP)

Equipment function: Grind and polish the body to be ground (semiconductor) through the combined action of mechanical grinding and chemical liquid dissolution “corrosion”.

Chemical Mechanical Polishers (CMP)

9 Lithography machine

Equipment function: The surface of the semiconductor substrate (silicon wafer) is uniformly glued, the pattern on the mask is transferred to the photoresist, and the device or circuit structure is temporarily “copied” to the silicon wafer.

Lithography machine

10 Reactive Ion Etching (RIE) System

Equipment function: high-frequency voltage is applied between the plate electrodes to generate an ion layer with a thickness of hundreds of microns, which is placed in the pattern, and the ions impact the pattern at high speed to realize chemical reaction etching and physical impact, and realize the processing and molding of semiconductors.

Reactive Ion Etching (RIE) System

11 ICP plasma etching system

Equipment function: One or more gas atoms or molecules are mixed in the reaction chamber to form plasma under the action of external energy (such as radio frequency, microwave, etc.), on the one hand, the active groups in the plasma and the surface material to be etched A chemical reaction occurs to generate volatile products; on the other hand, ions in the plasma are guided and accelerated under the action of a bias voltage to achieve directional corrosion and accelerated corrosion of the surface to be etched.

ICP plasma etching system

12 Wet etching and cleaning machine

Equipment function: Wet etching is a technology in which etching materials are immersed in etching solution for etching. Cleaning is to reduce contamination, because contamination will affect device performance, cause reliability problems, and reduce yield, which requires thorough cleaning before the next process of each layer or before the next layer.

Wet etching and cleaning machine

13 Ion Implanter (IBI)

Device function: Doping the area near the semiconductor surface.

Ion Implanter (IBI)

14 probe test stand

Equipment function: Through the contact between the probe and the pad of the semiconductor device, the electrical test is carried out to detect whether the performance index of the semiconductor meets the design performance requirements.

probe test stand

15 Wafer Thinner

Equipment function: reduce the thickness of the wafer by polishing.

Wafer Thinner

16 Wafer Dicing Machine (DS)

Equipment function: Die the wafer and cut it into small pieces.

Wafer Dicing Machine (DS)

17 Wire Bonder

Device function: Connect the Pad on the semiconductor chip and the Pad on the pin with a conductive metal wire (gold wire).

Wire Bonder

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